Array substrate of organic light-emitting diodes and method for packaging the same

ABSTRACT

A single display panel and an electronic device are provided. The single display panel comprises an upper substrate; a lower substrate including a display area and a stepped area; and a frame adhesive disposed between the upper substrate and the to a substrate, and surrounding the display area, wherein there is no blank area around the display panel. The single display panel is obtained from an array substrate comprising OLED display panels to be separated from each other through a cutting, wherein the display panel includes a display area, at least two adjacent display panels are connected through the frame adhesive disposed at an edge frame surrounding the display area but not covering the display area, and there is no cutting headroom between at least one side of the at least two adjacent display panels.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation-in-part (CIP) application of U.S.patent application Ser. No. 14/667,621, filed on Mar. 24, 2015 whichclaims the priority to Chinese Patent Application No. 201410822726.3,entitled “ARRAY SUBSTRATE OF ORGANIC LIGHT-EMITTING DIODES AND METHODFOR PACKAGING THE SAME”, and filed with the State Intellectual PropertyOffice of People's Republic of China oil Dec. 22, 2014, the content ofall of which is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present disclosure relates to the field of display and packagingtechnologies, and particularly to an array substrate of organiclight-emitting diodes and a method for packaging the same.

BACKGROUND OF THE INVENTION

As illustrated in FIG. 1 an array substrate 10 of Organic Light-EmittingDiodes (OLEDs) in the prior art includes a plurality of display panels11 arranged in an array, and each display panel 11 includes a displayarea 12, a frame adhesive 13 with a width of 0.7 mm at an edge frame ofthe display area 12, and a stepped area 14 which is an area in thedisplay panel where an integrated circuit is fabricated. There is acutting headroom between every two display panels 11, the cuttingheadroom is an area without frame adhesive 13 at the locations where thearray substrate 10 is cut into a single display panel 11. In FIG. 1,there are a width B of a cutting headroom between two adjacent displaypanels 11 in the horizontal direction, and a width A of a cuttingheadroom between two adjacent display panels 11 in the verticaldirection, and in order to prevent damage to the display panels beingcut, the width A or B of the cutting headroom in a practical productionprocess is preset to 600 to 800 micrometers.

In FIG. 1, due to the cutting headroom between every two display panels,each display panel needs to be packaged by coating the frame adhesivethereto separately and laser curing the coated frame adhesiveseparately. FIG. 2 illustrates a structural diagram of a single packageddisplay panel in a sectional view, the frame adhesive 13 is disposedbetween an upper substrate 21 and a lower substrate 20 and laser curedby disposing a reflection layer 22 on the lower substrate 20, to therebybetter reflect a laser beam so as to make the laser beam more uniform.

In summary, the width A or B of the frame adhesive in the prior art ispreset to 600 to 800 micrometers, so that the edge frame of the displaypanel may become large instead of being narrowed. Moreover, it may takea long period of time to perform the packaging process in the prior artdue to the separate adhesive coating process and the separate lasercuring process, and each display panel has to he packaged by coating theframe adhesive thereto separately, and laser curing the coated frameadhesive separately, so that there may be wastes of time and materials,and the substrates may be underutilized. Moreover, it may take a longperiod of time to cure the adhesive by using laser, thus resulting ininefficiency.

BRIEF SUMMARY OF THE INVENTION

One aspect of the present disclosure provides a single display panel.The single display panel comprises an upper substrate; a lower substrateincluding a display area and a stepped area adjacent to the displayarea; and a frame adhesive disposed between the upper substrate and thelower substrate, and surrounding the display area, wherein: the uppersubstrate and the lower substrate are coupled to each other by the frameadhesive, there is no blank area around the display panel, a blank areaof the single display panel being an area of the upper substrate andlower substrate and disposed surrounding the frame adhesive, and thesingle display panel is obtained from an array substrate comprising aplurality of packaged organic light-emitting diode (OLED) display panelsarranged in an array of rows and columns and to be separated from eachother through a cutting, wherein the display panel includes a displayarea, at least two adjacent display panels are connected through theframe adhesive disposed at an edge frame surrounding the display areabut not covering the display area, and there is no cutting headroombetween at least one side of the at least two adjacent display panels.

Another aspect of the present disclosure provides an electronic devicecomprising the single display panel.

Other aspects of the present disclosure can he understood by thoseskilled in the art in light of the description, the claims, and thedrawings of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a top plan of an array substrate of organiclight-emitting diodes in the prior art;

FIG. 2 illustrates a cross-sectional view of a display panel in thearray substrate of organic light-emitting diodes in the prior art;

FIG. 3 illustrates a flow chart of a method for packaging an arraysubstrate of organic light-emitting diodes according to an embodiment ofthe present disclosure;

FIG. 4 illustrates a top plan view of an array substrate of organiclight-emitting diodes according to a first embodiment of the presentdisclosure;

FIG. 5a and FIG. 5b illustrate top plan views of an array substrate oforganic light-emitting diodes according to a second embodiment of thepresent disclosure;

FIG. 6 illustrates across-sectional view of a part of an area of thearray substrate of organic light-emitting diodes according to the firstembodiment and the second embodiment of the present disclosure;

FIG. 7 illustrates a plan view of a single display panel as a result ofcutting in the prior art;

FIG. 8 illustrates a plan view of a single display panel as a result ofcutting according to the first embodiment and the second embodiment ofthe present disclosure;

FIG. 9 illustrates a C-C′ sectional view of a single display panel inFIG. 7 as a result of cutting in the prior art;

FIG. 10a illustrates an A-A′ sectional view of a single display panel inFIG. 8 as a result of cutting according to the first embodiment and thesecond embodiment of the present disclosure;

FIG. 10b illustrates a B-B′ sectional view of a single display panel inFIG. 8 as a result of cutting according to the first embodiment and thesecond embodiment of the present disclosure;

FIG. 11 illustrates a cross-sectional view of another exemplary singledisplay panel according to the embodiments of the present disclosure;and

FIG. 12 illustrates an exemplary electronic device according to theembodiments of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present disclosure provide an array substrate oforganic light-emitting diodes and a method for fabricating the same, soas to narrow an edge frame of the product of organic light-emittingdiodes, to shorten the package process time, to improve the substrateutilization and to improve the production efficiency.

In order to make the objects, technical solutions and advantages of thepresent disclosure more apparent, the present disclosure will bedescribed below in further details with reference to the drawings, andevidently the embodiments described here are merely a part but not allof the embodiments. All the other embodiments which can occur to thoseordinarily skilled in the art from embodiments here of the presentdisclosure without any inventive effort shall fall into the scope of thepresent disclosure.

The technical solutions according to embodiments of the presentdisclosure will be described below in details.

As illustrated in FIG. 3, a method for packaging an array substrate oforganic light-emitting diodes according to an embodiment of the presentdisclosure includes the following operations:

S301: coat a frame adhesive to at least two adjacent display panels, sothat there is no cutting headroom between at least one side of the atleast two adjacent display panels;

S302: cure the frame adhesive using a first laser beam;

S303: ablate the frame adhesive using a second laser beam at thelocation where cutting is needed, so that a broken area is generated onthe surface of the frame adhesive at the cut locations, herein the powerof the first laser bean n is higher than the power of the second laserbeam; and

S304: cut the array substrate, at the cut locations, into single displaypanels.

An embodiment of the present disclosure further provides an arraysubstrate of organic light-emitting diodes, the array substrateincluding a plurality of display panels disposed in, an array, herein atleast two adjacent display panels are connected through a frameadhesive, and there is no cutting headroom, between at least one side ofthe at least two adjacent display panels.

The array substrate of organic light emitting diodes according to anembodiment of the present disclosure will be described below in detailswith reference to FIG. 4, FIG. 5a and FIG. 5 b.

FIRST EMBODIMENT

As illustrated in FIG. 4, a first embodiment of the present disclosureprovides an array substrate 40 of organic light-emitting diodes, thearray substrate including a plurality of display panels 41 disposed inan array, herein at least two adjacent display panels 41 are connectedthrough a frame adhesive 13, and there is no cutting headroom (spacing)between at least one sides of at least two adjacent display panels.There is no stepped area disposed in the display panels 41 according tothe first embodiment of the present disclosure, and optionally there isno cutting headroom in any two adjacent display panels 41.

According to the first embodiment of the present disclosure, a methodfor packaging the array substrate 40 of organic light-emitting diodesincludes: coating a frame adhesive to all display panels 41 at a time,so that the all display panels 41 are connected through the frameadhesive 13 and there is, no cutting headroom between the display panels41. Optionally the coated frame adhesive 13 is cured using a first laserbeam which is an infrared laser beam at a wavelength of 788 to 828nanometers, and a power of 1 to 10 watts. Particularly the first laserbeam in the first embodiment of the present disclosure is at awavelength of 808 nanometers (nm), a power of 5 watts (W), a speed of 5millimeters per second (mm/s), a temperature of 350° C. and an energypenetration distance of 1.8 millimeters (mm).

Next the frame adhesive is ablated by using a second laser beam, whichis an infrared, laser beam at a wavelength of 788 to 828 nanometers anda power of 5 to 15 watts, at the locations where cutting is needed, sothat a broken area is generated on the surface of the frame adhesive 13at the cut locations. Particularly the second laser beam in the firstembodiment of the present disclosure is at a wavelength of 808 nm, apower of 10 W, a speed of 20 mm/s, a temperature of 500° C. and anenergy penetration distance of 0.2 mm.

Finally the array substrate is cut, at the cut locations, into singledisplay panels, the directed arrows 47, 48 in FIG. 4 represent the cutlocations, and particularly the array substrate is cut at the cutlocations (lines), according to the first embodiment of the presentdisclosure, by cutting the array substrate respectively at the cutlocations in the broken area. Optionally according to the firstembodiment of the present disclosure, the locations where cutting isneeded are determined by using alignment cutting markers in an imagecontroller, particularly alignment markers in Charge Coupled Devices(CCDs), i.e., CCD image sensors. The frame adhesive can be ablated, byusing the second laser beam with an energy greater than the first laserbeam, at the locations where cutting is needed according to the firstembodiment or the present disclosure, so that the surface of the frameadhesive 13 can be broken as appropriate to facilitate separation, andsubsequently the frame adhesive can be cut at the cut locationsmechanically by using a knife wheel.

FIG. 6 illustrates a simplified cross-sectional view of an area 42 ofthe array substrate 40 of organic light-emitting diodes according to thefirst embodiment and the second embodiment of the present disclosure,where the area includes an upper substrate 61 and a lower substrate 60,and the frame adhesive 13 between the upper substrate 61 and the lowersubstrate 60, and the dotted lines represent the locations where theframe adhesive is ablated by using the second laser beam, and also thelocations where the array substrate is subsequently cut mechanically byusing a knife wheel.

SECOND EMBODIMENT

As illustrated in FIG. 5a and FIG. 5 b, a second embodiment of thepresent disclosure provides an array substrate of organic light-emittingdiodes 50, the array substrate including a plurality of display panels11 arranged in an array of rows and columns, herein at least twoadjacent display panels 11 are connected, through a frame adhesive 13,and there is no cutting headroom between at least one side of the twoadjacent display panels. There is a stepped area 14 disposed in thedisplay panels 11 according to the second embodiment of the presentdisclosure, Each of the display panels 11 includes a display area 12, aframe adhesive 13 surrounding display area 12, and a stepped area 14disposed at one side of frame adhesive 13.

Optionally in the second embodiment of the present disclosure, a displaypanel unit includes at least two display panels, and there is no cuttingheadroom between at least one side of two adjacent display panels otherthan the stepped area sides, as illustrated in FIG. 5a and FIG. 5b . Inother words, at least one side between two adjacent display panelsexcept the side of the stepped area has no cutting headroom.

As illustrated in FIG. 5 a, in the second embodiment of the presentdisclosure, the display panel unit 51 includes each column of displaypanels 11, and the stepped area 14 of a column of display panels 11 isdisposed on the left side or right side of the column of display panels11. There is a cutting headroom disposed between every two adjacent setsof display panel units 51, and the width B of the cutting headroom inthe second embodiment of the present disclosure is preset to 600 to 800micrometers as in the prior art.

As illustrated in FIG. 5 b, in the second embodiment of the presentdisclosure, the display panel unit 52 includes two or multiple pairs ofadjacent columns of display panels 11, and the stepped area 14 of a pairof adjacent columns of display panels 11 is disposed on the left side ofthe column of display panels 11, whereas the stepped area 14 of theother column of display panels 11 is disposed on the right side of thecolumn of display panels 11; and there is neither cutting headroombetween sides of two adjacent display panels 11 in the row direction,nor cutting headroom between sides of two adjacent display panels 11 inthe column direction. There is a cutting headroom disposed between everytwo adjacent sets (every pair of adjacent columns) of display panelunits 52, and the width B of the cutting headroom, in the secondembodiment of the present disclosure, is preset to 600 to 800micrometers as in the prior art.

According to the second embodiment of the present disclosure, a methodfor packaging the array substrate of organic light-emitting diodes 50includes coating a frame adhesive respectively to the display panelunits 51 or 52, that is, the frame adhesive in the display panel units51 or 52 is coated at a time, so that the display panels 11 in thedisplay panel units 51 or 52 are connected by the frame adhesive 13, andthere is no cutting headroom between the display panels 11. In thesecond embodiment of the present disclosure, the coated frame adhesive13 is cured by using a first laser beam which is substantially the sameas the first laser beam in the first embodiment of the presentdisclosure, so that a repeated description thereof will be omitted here.

Next, the frame adhesive is ablated by using a second laser beam at thelocations where cutting is needed, so that a broken area is generated onthe surface of the frame adhesive 13 at the cut locations. The secondlaser beam in the second embodiment of the present disclosure issubstantially the same as the second laser beam in the first embodimentof the present disclosure, so that a repeated description thereof willbe omitted here.

Finally the array substrate is cut, at the cut locations, into singledisplay panels. The directed arrows in FIG. 5a and FIG. 5b represent thecut locations. And particularly the array substrate is cut at the cutlocations, according to the second embodiment of the present disclosure,by cutting the array substrate respectively at the cut locations in thecutting headroom disposed between two adjacent sets of display panelunits, and the cut locations in the broken area. Optionally according tothe second embodiment of the present disclosure, the locations wherecutting is needed are determined by using alignment cutting markers inan image controller, particularly alignment markers in CCD imagesensors. The frame adhesive can be ablated by using the second laserbeam at an energy stronger than the first laser beam at the locationswhere cutting is needed according to the second embodiment of thepresent disclosure, so that the surface of the frame adhesive 13 can bebroken as appropriate to facilitate cutting for separation, andsubsequently the frame adhesive can be cut at the cut locationsmechanically by using a knife wheel.

FIG. 6 illustrates a schematic structural diagram of an area 53 of thearray substrate of organic light-emitting diodes 50 in FIG. 5a and anarea 54 of the array substrate of organic light-emitting diodes 50 inFIG. 5b in a sectional view, the areas include an upper substrate 61 anda lower substrate 60. and the frame adhesive 13 between the uppersubstrate 61 and the lower substrate 60. The dotted lines represent thelocations where the frame adhesive is ablated by using the second laserbeam and also the locations where the array substrate is subsequentlycut mechanically by using a knife wheel.

FIG. 7 illustrates a schematic structural diagram of a single displaypanel as a result of cutting in the prior art in a plan view, and FIG. 9illustrates a C-C′ sectional view of a single display panel in FIG. 7 asa result of cutting in the prior art. As shown in FIG. 9, after thecutting, the single display panel has an upper substrate 21, a lowersubstrate 20, a display area 12 and a frame adhesive 13 disposed betweenthe upper substrate 21 and the lower substrate 20. The frame adhesive13, which is disposed surrounding the display area 12, seals the singledisplay panel and, meanwhile, maintains a cell gap of the single displaypanel. The reflection layer 22 is disposed on the lower substrate 20 andfacilitates the curing of the frame adhesive.

In addition, as shown in FIG. 7 and FIG. 9, there is, a blank area 70around the single display panel in the prior art. The blank area 70 ofthe single display panel refers to an area of the upper substrate 21 andan area of the lower substrate 20, in which the area is disposedsurrounding the frame adhesive 13. The blank area may not be disposedwith any frame adhesive. The blank area 70 of the existing singledisplay panel often has a width d of about 300 to 400 micrometers and,thus, the existing single display panel may be bulky, which requires alarge space to fit into an electronic device.

FIG. 8 illustrates a schematic structural diagram of a single displaypanel as a result of cutting according to the embodiments of the presentdisclosure in a plan view. FIG. 10a illustrates an A-A′ sectional viewof a single display panel in FIG. 8 as a result of cutting according tothe first embodiment and the second embodiment of the presentdisclosure. FIG. 10b illustrates a B-B′ sectional view of a singledisplay panel in FIG. 8 as a result of cutting according to the firstembodiment and the second embodiment of the present disclosure.

As shown in FIGS. 8 and 10 a-10 b, after being cut from the arraysubstrate, the single display panel may comprise an upper substrate 61,a lower substrate 60 including a display area 12 and a stepped area 14adjacent to the display area 12; and a frame adhesive 13 disposedbetween the upper substrate 61 and the lower substrate 60, andsurrounding the display area 12. The frame adhesive 13 may seal thesingle display panel and maintain a cell gap of the single displaypanel. The upper substrate 61 and the lower substrate 60 may be coupledto each other by the frame adhesive 13. The display area 12 may bedisposed with a display element, and the stepped area 14 may be disposedwith an integrated circuit for controlling the display panel.

Different from the existing single display shown in FIG. 7 and FIG. 9,in the single display shown in FIGS. 8 and 10 a-10 b, there is no blankarea around the single display panel according to the embodiments of thepresent disclosure. That is, the single display panel may not have ablank area surrounding the frame adhesive 13. Thus, the entire frame ofthe single display panel may be reduced, while the display area of thesingle display panel may substantially remain the same. The corecompetitiveness of the product may be improved according to the presentdisclosure. For example, the disclosed single display panel withoutblank area may be highly desired in wearable electronic devices.

FIG. 11 illustrates a cross-sectional view of another exemplary singledisplay panel according to the embodiments of the present disclosure.The similarities between FIG. 11 and FIG. 10b are not repeated here,while certain differences may be explained.

Different from the single display panel shown in FIGS. 10b , the singledisplay panel shown in FIG. 11 may further include a reflection layer 22disposed on the lower substrate 60. The reflection layer 22 may besandwiched between the frame adhesive 13 and the lower substrate 60(i.e., beneath the frame adhesive 13), and disposed surrounding thedisplay area 12. The reflection layer 22 may include metals, whichreflect a laser beam so as to make the laser beam more uniform. Inparticular, the reflection layer 22 may be formed on the lower substrate60 before coating a frame adhesive to at least two adjacent displaypanels, when packaging an array substrate of organic light-emittingdiodes. That is, referring to FIG. 3, the reflection layer 22 may beformed on the lower substrate before Step S301.

The present disclosure also provides an electronic device. FIG. 12illustrates an exemplary electronic device according to the embodimentsof the present disclosure. As shown in FIG. 12, the electronic device1200 may include a display panel 1202, which may be any of the disclosedsingle display panels. The electronic device 1200 may be a smartwearable device, a tablet, a TV, a smartphone, a notebook, and, adigital frame, etc. Further, the electronic device 1200 may be anyappropriate type of content-presentation devices.

Because the electronic device 1200 includes any of the disclosed singledisplay panels, the disclosed electronic device may also exhibit thesame advantages as the disclosed single display panels. That is, due thesingle display panel 1202 without blank area, the electronic device 1200with a Shrunk border region, which may save precious space when theelectronic device is further implemented into other devices. Forexample, a circular speedometer with a shrunk border region may saveprecious space in a vehicle's crowded dashboard, which alt requires roomfor car-navigation displays and other recent additions.

In summary, according to embodiments of the present disclosure, there isno cutting headroom disposed between a part of adjacent display panelsor between every two adjacent display panels, so that the frame adhesivecan be coated directly to the all display panels being packaged, tothereby extend the display area from the inside thereof and narrow theedge frame by approximately 500 micrometers, so as to narrow the edgeframe and improve the competitiveness of the product while guaranteeingthe width 0.7 mm of the package. Moreover, it will not be necessary tocoat the frame adhesive respectively to each display panel beingpackaged, to shorten the process time, reduce the material cost andimprove the production efficiency.

It is noted that the preferable embodiments and the applied technologyprinciples of the present disclosure are merely described as above. Itshould be understood for those skilled in the art that the presentdisclosure is not limited to particular embodiments described herein.Various apparent changes, readjustment and alternative can be made bythose skilled in the art without departing from the scope of protectionof the present disclosure. Therefore, although the present disclosure isillustrated in detail through the above specific embodiments, thepresent disclosure is not limited to the above embodiments, and canfurther include more of other equivalent embodiments without departingconcept of the present disclosure. The scope of the present disclosureis subject to the appended claims.

What is claimed is:
 1. A single display panel, comprising: an uppersubstrate; a lower substrate including a display area and a stepped areaadjacent to the display area; and a frame adhesive disposed between theupper substrate and the lower substrate, and surrounding the displayarea, wherein: the upper substrate and the lower substrate are coupledto each other by the frame adhesive, there is no blank area around thedisplay panel, a blank area of the single display panel being an area ofthe upper substrate and lower substrate and disposed surrounding theframe adhesive, and the single display panel is obtained from an arraysubstrate comprising a plurality of packaged organic light emittingdiode (OLED) display panels arranged in an array of rows and columns andto be separated from each other through a cutting, wherein the displaypanel includes a display area, at least two adjacent display panels areconnected through the frame adhesive disposed at an edge framesurrounding the display area but not covering the display area, andthere is no cutting headroom between at least one side of the at leasttwo adjacent display panels.
 2. The single display panel according toclaim 1, wherein the single display panel comprises: a cutting headroomis an area without the frame adhesive at locations where the arraysubstrate is cut into a plurality of single display panels.
 3. Thesingle display panel according to claim 1, wherein: the display area ofthe single display panel is disposed with a display element, and thestepped area of the of the single display panel is disposed with anintegrated circuit for controlling the single display panel.
 4. Thesingle display panel according to claim 1, further including: areflection layer disposed beneath the frame adhesive and surrounding thedisplay area of the single display panel.
 5. The single display panelaccording to claim 1 wherein: there is no cutting headroom between everytwo adjacent display panels connected through the frame adhesive.
 6. Thesingle display panel according to claim 1, wherein: a display panel unitcomprises at least two display panels to be separated from each otherthrough the cutting, in the display panel unit there is no cuttingheadroom between at least one side of two adjacent display panels otherthan stepped area sides, and the two adjacent display panels areconnected through the frame adhesive.
 7. The single display panelaccording to claim 6, wherein: the display panel unit comprises a columnof display panels.
 8. The single display panel according to claim 6,wherein: the display panel unit comprises two adjacent columns ofdisplay panels connected through the frame adhesive, each column ofdisplay panels includes at least two display panels connected throughthe frame adhesive, a first stepped area disposed and on the left sideof the two adjacent columns of display panels, a second stepped areadisposed on the right side of the two adjacent columns of displaypanels; there is no cutting headroom between the two adjacent columns ofdisplay panels in a row direction, and there is no cutting headroombetween the two adjacent columns of display panels in a columndirection.
 9. The single display panel according to claim 6, wherein:there is a cutting headroom disposed between every two display panelunits.
 10. An electronic device, comprising a single display panel,wherein: the single display panel comprises, an upper substrate; a lowersubstrate including a display area and a stepped area adjacent to thedisplay area; and a frame adhesive disposed between the upper substrateand the lower substrate, and surrounding the display area, wherein: thetipper substrate and the lower substrate are coupled to each other bythe frame adhesive, there is no blank area around the display panel, ablank area of the single display panel being an area of the uppersubstrate and lower substrate and disposed surrounding the frameadhesive, and the single display panel is obtained from an arraysubstrate comprising a plurality of packaged organic light-emittingdiode (OLED) display panels arranged in an array of rows and columns andto be separated from each other through a cutting, wherein the displaypanel includes a display area, at least two adjacent display panels areconnected through the frame adhesive disposed at an edge framesurrounding the display area but not covering the display area, andthere is no cutting headroom between at least one side of the at leasttwo adjacent display panels.
 11. The electronic device according toclaim 10, wherein the single display panel comprises: a cutting headroomis an area without the frame adhesive at locations where the arraysubstrate is cut into a plurality of single display panels.
 12. Theelectronic device according to claim 10, wherein: the display area ofthe single display panel is disposed with a display element, and thestepped area of the of the single display panel is disposed with anintegrated circuit for controlling the single display panel.
 13. Theelectronic device according to claim 10, wherein the single displaypanel further including: a reflection layer disposed beneath the frameadhesive and surrounding the display area of the single display panel.14. The electronic device according to claim 10, wherein: there is nocutting headroom between every two adjacent display panels connectedthrough the frame adhesive.
 15. The electronic device according to claim10, wherein: a display panel unit comprises at least two display panelsto be separated from each other through the cutting, in the displaypanel unit there is no cutting headroom between at least one side of twoadjacent display panels other than stepped area sides, and the twoadjacent display panels are connected through the frame adhesive. 16.The electronic device according to claim 15, wherein: the display panelunit comprises a column of display panels.
 17. The electronic deviceaccording to claim 15, wherein: the display panel unit comprises, twoadjacent columns of display panels connected through the frame adhesive,each column of display panels includes at least two display panelsconnected through the frame adhesive, a first stepped area disposed andon the left side of the two adjacent columns of display panels, a secondstepped area disposed on the right side of the two adjacent columns ofdisplay panels; there is no cutting headroom between the two adjacentcolumns of display panels in a row direction, and there is no cuttingheadroom between the two adjacent columns of display panels in a columndirection.
 18. The electronic device according to claim 15, wherein:there is a cutting headroom disposed between every two display panelunits.